| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical inspection equipment suitable for reduction in size and contributive to cost reduction will with a crack or a chip can be detected readily on the circumferential surface of a wafer. SOLUTION: The optical inspection equipment is provided with a light irradiating means having a first optical component constituted of a Fresnel lens or a Fresnel reflector for irradiating one side of the wafer with light from a spot light source rendered parallel, a second optical component constituted of a Fresnel lens or a Fresnel reflector and condensing parallel light passing through the outside of the outer circumferential part of the wafer, a first light receiving part receiving light from the second optical component, a first light projecting means for projecting light toward the circumferential surface of the wafer through a projection fiber, and a second light receiving part receiving light reflected on the circumferential surface of the wafer. COPYRIGHT: (C)2004,JPO
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