| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide resin suitable for an adhesive film which is used as a material for mounting electronic parts, allows assembly at a low temperature and has strong bonding characteristics and excellent heat resistance. SOLUTION: The polyimide resin is obtained by reacting a styrene/maleic anhydride copolymer (A) with an aromatic isocyanate and/or an aliphatic isocyanate to give a polymer, and reacting the polymer with an aromatic tetracarboxylic acid dianhydride and an aromatic diamine and/or an aliphatic diamine. It is desirable that the content of the component (A) is 1-50 mol% based on the total acid components. The resin has a reactive functional group in its structure. COPYRIGHT: (C)2004,JPO
|
