| 摘要 |
The electronic module (10) comprises an interconnection support with a substrate (12), which is flexible, semi-rigid or rigid, equipped with a set of contact zones (14) deposited on its upper face (16), a first electronic chip (18) fastened on the substrate (12) by its inactive face and equipped with a set of contact pads (22) on its active face, and a second electronic chip (26) whose active face is equipped with conducting bumps (30) and mounted on the active face (20) of the first chip (18) so that the bumps (30) are in contact with the pads (22). The contacts pads (22) of the first chip (18) and the bumps (30) of the second chip (26) are directly connected. In the second embodiment, the contact pads of the first chip and the bumps of the second chip are connected by the intermediary of a plate equipped with adapting pads traversing the plate. The plate is insulating, for example of benzocyclobutene, and of thickness of a few micrometres. The inactive face of the second chip (26) constitutes the upper face and can be prepared for supporting another chip. |
