| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin composition which causes a small package warpage after reflow in component mounting subsequent to molding with an LOC structure thin semiconductor package at least 50% of which is occupied by the constituent semiconductor element and is excellent in solder reflow resistance when used in various thin semiconductor devices of LOC structure, non-LOC structure, and non-LOC window pad structures for memories. SOLUTION: The epoxy resin composition essentially consists of an epoxy resin containing at least 30 wt.% epoxy resin prepared by glycidyl-etherifying a phenolic resin containing at least 50 wt.% phenolic resin having a trihydroxytriphenylmethane skeleton, a phenol aralkyl resin having a phenylene skeleton, a cure accelerator, and an inorganic filler, wherein the inorganic filler is contained in an amount of 85-92 wt.% based on the entire epoxy resin composition, and the differences between the shrinkage percentage of a cured product of the composition and that of a lead frame and between the shrinkage percentage of the cured product and a semiconductor element are each 0.30% or smaller. COPYRIGHT: (C)2004,JPO
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