发明名称 CURABLE RESIN COMPOSITION AND RESIN CURED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition exhibiting excellent curability in various curing systems including thermal curing at ordinary temperature, and a resin cured product obtained from the composition. SOLUTION: The curable resin composition comprises an unsaturated polyester (A) bearing a dicyclopentadiene unit, a vinyl ether monomer (B) and a metal-containing curing accelerator (C), and further contains, according to a curing system employed, a thermal free radical polymerization initiator (D) and/or a photopolymerization initiator (E). By employing as the vinyl ether monomer (B) one having a specific boiling point and a specific structure, volatilization of an unreacted vinyl ether monomer (B) and the existence itself of the unreacted vinyl ether monomer (B) can be reduced in the resin cured product obtained from the curable resin composition. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003342332(A) 申请公布日期 2003.12.03
申请号 JP20020152503 申请日期 2002.05.27
申请人 NIPPON SHOKUBAI CO LTD 发明人 MATSUKAWA KENJI;TANAKA JUNKO
分类号 C08F283/01;(IPC1-7):C08F283/01 主分类号 C08F283/01
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