| 摘要 |
While a transfer surface 10 a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44 B on a contact sheet 44 formed on a substrate 44 M having the coefficient of linear expansion larger than that of the transfer plate 10 at a predetermined pressure, the substrate 44 M and the transfer plate 10 are heated to a predetermined temperature to recover the surface roughness of the bump 44 B to a predetermined value. |
