发明名称 Formation of an embedded capacitor plane using a thin dielectric
摘要 A capacitor, which has a pair of conductive foils each having a dielectric layer on its surface, wherein the dielectric layers are attached to one another. In one process for its production, a capacitor is formed by applying a first dielectric layer onto a surface of a first conductive foil; applying a second dielectric layer onto a surface of a second conductive foil; and then attaching the first and second dielectric layers to one another. The resulting capacitor exhibits excellent void resistance.
申请公布号 US6657849(B1) 申请公布日期 2003.12.02
申请号 US20000644959 申请日期 2000.08.24
申请人 OAK-MITSUI, INC. 发明人 ANDRESAKIS JOHN A.;SKORUPSKI EDWARD C.;ZIMMERMAN SCOTT;SMITH GORDON
分类号 H01G4/30;H01G4/10;H01G4/18;H01G4/20;H01L25/00;H05K1/16;H05K3/14;(IPC1-7):H01G4/06 主分类号 H01G4/30
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