发明名称 |
Formation of an embedded capacitor plane using a thin dielectric |
摘要 |
A capacitor, which has a pair of conductive foils each having a dielectric layer on its surface, wherein the dielectric layers are attached to one another. In one process for its production, a capacitor is formed by applying a first dielectric layer onto a surface of a first conductive foil; applying a second dielectric layer onto a surface of a second conductive foil; and then attaching the first and second dielectric layers to one another. The resulting capacitor exhibits excellent void resistance.
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申请公布号 |
US6657849(B1) |
申请公布日期 |
2003.12.02 |
申请号 |
US20000644959 |
申请日期 |
2000.08.24 |
申请人 |
OAK-MITSUI, INC. |
发明人 |
ANDRESAKIS JOHN A.;SKORUPSKI EDWARD C.;ZIMMERMAN SCOTT;SMITH GORDON |
分类号 |
H01G4/30;H01G4/10;H01G4/18;H01G4/20;H01L25/00;H05K1/16;H05K3/14;(IPC1-7):H01G4/06 |
主分类号 |
H01G4/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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