| 摘要 |
A heat dissipating flip-chip Ball Grid Array (BGA) (10) including a substrate (12), a die (14), a first set of solder balls (16) coupling the die with the substrate, a thermal compound (20) attached to a backside of the die, a second set of solder balls (28) attached to the substrate, and a printed circuit board (22) that includes a heat dissipating metal (24). The heat dissipating metal is in contact with the thermal compound, and the second set of solder balls is connected to thermal vias in the printed circuit board.
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