发明名称 Data transfer on reconfigurable chip
摘要 A reconfigurable chip having reconfigurable elements uses an interconnection system which reduces the maximum signal rise and fall time. In one embodiment, the maximum rise and fall time is reduced by providing bypass paths. In another embodiment, buffers are used to reduce signal rise and fall times. Connections between each of the elements are provided by either providing a loop path or by providing bidirectional arrangements of the buffers.
申请公布号 US6657457(B1) 申请公布日期 2003.12.02
申请号 US20000526695 申请日期 2000.03.15
申请人 INTEL CORPORATION 发明人 HANRAHAN SHAILA;LAM PETER SHING FAI
分类号 H03K19/177;(IPC1-7):H03K19/177 主分类号 H03K19/177
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