| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide metal laminate which has a small humidity expansion coefficient of a polyimide and an excellent dimensional accuracy and which can form a fine wiring pattern and to provide a method for manufacturing the same and particularly a highdensity circuit board material. SOLUTION: The polyimide metal laminate is obtained by directly stitching the polyimide to a metal. In this laminate, the humidity expansion coefficient of the polyimide is O to less than 10 ppm/%RH, and the thermal expansion coefficient of the polyimide is 10 to 25 ppm/°C. The method for manufacturing the polyimide metal laminate comprises the steps of laminating the polyimide and the metal by heat press bonding, coating the precursor of the polyimide on the metal, drying and laminating them, combining them to laminate them, or any of them. COPYRIGHT: (C)2004,JPO |
