发明名称 Partial plating system
摘要 A partial plating system able to gold plate only inner leads of a TAB frame, provided with a mask having an opening formed to correspond to a plating region of a TAB frame and provided horizontally; an elevating means for lowering the TAB frames toward the mask; and a pressing means for pressing the TAB frame on to the mask; a plating solution being sprayed from below the openings toward the openings to plate the plating region.
申请公布号 US6656275(B2) 申请公布日期 2003.12.02
申请号 US20010841224 申请日期 2001.04.24
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 IWAMOTO SHIGEKI
分类号 C25D5/02;C25D7/06;C25D7/12;C25D17/00;H01L21/60;H01L23/495;H05K3/18;(IPC1-7):B05B15/04 主分类号 C25D5/02
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