发明名称 |
Partial plating system |
摘要 |
A partial plating system able to gold plate only inner leads of a TAB frame, provided with a mask having an opening formed to correspond to a plating region of a TAB frame and provided horizontally; an elevating means for lowering the TAB frames toward the mask; and a pressing means for pressing the TAB frame on to the mask; a plating solution being sprayed from below the openings toward the openings to plate the plating region.
|
申请公布号 |
US6656275(B2) |
申请公布日期 |
2003.12.02 |
申请号 |
US20010841224 |
申请日期 |
2001.04.24 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
IWAMOTO SHIGEKI |
分类号 |
C25D5/02;C25D7/06;C25D7/12;C25D17/00;H01L21/60;H01L23/495;H05K3/18;(IPC1-7):B05B15/04 |
主分类号 |
C25D5/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|