<p>A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.</p>
申请公布号
AU2003233567(A1)
申请公布日期
2003.12.02
申请号
AU20030233567
申请日期
2003.05.15
申请人
HONEYWELL INTERNATIONAL INC.
发明人
SHINYA MYOJIN;RICHARD, L. BYE;GARY, B., A. SCHUSTER;DALE, R. WALLS;JOSEPH, G. COX;DAVID, W. MILLURE;JENG, S. LIN;NICHOLAS, J. DECRISTOFARO