| 摘要 |
The present invention includes a semiconductor package that forms a solder array joints on the die surface and their corresponding PCB respectively. The life times of array solders are increased through use of two set of array joints that have high and low melting points. The high melting solders are served as the dummy ones to sustain the overall stand-offs of array joints. The solder size in the same solder array is identical. The melting solders with high and low melting points implemented on a semiconductor die are heading one to one attached to the correspondingly melting solders of high and low melting points in PCB site. The reflow temperature of smt assembly is between the aforemetioned high and low melting points. In addition, the solder joints with directional properties are made so as to make the fanout connections on PCB site.
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