| 摘要 |
Copper etchant solution additives (18) for use with an aqueous alkaline ammoniacal cupric chloride etching bath (12) include several compounds, each of which is shown to stabilize the copper (I) state. The compounds discovered by tbe present invention include iodid e ions such as potassium iodide, ammonium iodide, sodium iodide, calcium iodide and magnesium iodide. Other copper (I) stabilizers discover ed by the present invention include certain water soluble salts containing sulfur such as a thiocyanate ion (e.g. ammonium thiocyanate, po tassium thiocyanate, sodium thiocyanate, magnesium thiocyanate, and calcium thiocyanate) and a thiosulfate ion (e.g. ammonium thiosulfate, potassium thiosulfate, sodium thiosulfate, magnesium thiosulfate, and calcium thiosulfate). Etching rates for alkaline ammoniacal cu pric chloride with different concentrations of potassium iodide, ammonium thiocyanate, and sodium thiosulfate were studied. The results o f controlled experiments revealed that adding concentrations up to approximately 1200 mg/L of any one of these compounds to the alkali ne ammoniacal cupric chloride etchant resulted in a 20-130 % increase in etch rate.
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