发明名称 METHOD AND APPARATUS FOR REMOVING RESIDUAL STRESS AND STRAIN OF CASE
摘要 PROBLEM TO BE SOLVED: To remove the residual stress and strain of a molded case while maintaining the shape of the molding before being heated. SOLUTION: The case 3 which is composed of a side frame part 1 and a roof part 2 and made of a crystalline resin and in which the thickness of the roof part 2 is smaller than that of the side frame part 1 is molded. After that, while the case 3 is held at a constant pressure by a grasping apparatus 5 comprising at least two grasping instruments 4 which have the same shape and size with those of the case 3 and can grasp the whole case 3, the case 3 is heated by energy rays through a permeable member 6 fitted to at least one of the grasping instruments 4. After that, the case 3 is cooled by coolers 7 fitted to the grasping instruments. A heating quantity by being irradiated with the energy rays and a cooling quantity by the coolers 7 are controlled by measuring the temperature of the case 3 by a temperature sensor 8. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003340929(A) 申请公布日期 2003.12.02
申请号 JP20020153213 申请日期 2002.05.28
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 INOUE AKIRA;AZUMA KEIJI
分类号 B29C71/02;(IPC1-7):B29C71/02 主分类号 B29C71/02
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