EXPOSURE MASK OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: An exposure mask of a semiconductor device is provided to the exposure mask from being affected by an edge bead by forming a groove in the outside so that the exposure mask is aligned with a wafer by a desired gap. CONSTITUTION: The wafer is covered with a mask(300) for exposing a photoresist layer wherein the edge bead is formed at the edge of the wafer. A substrate has a groove(330) in a position corresponding to the edge bead. A light intercepting layer(320) is formed on the substrate having the groove. The groove formed in the substrate is of a ring type, having a width of 2-3 millimeter.