发明名称 METHOD OF MANUFACTURING MULTI-CLAD PANEL HAVING COPPER PLATE
摘要 PURPOSE: A method of manufacturing a multi-clad panel having at least a copper(Cu) plate is provided, which has good interlayer adhesion by preventing a surface of the Cu plate from being oxidized even if it is heated at a high temperature during pressure bonding. CONSTITUTION: The method of manufacturing a multi-clad panel having at least a Cu plate(1) comprises: sequentially applying nickel(Ni) and chromium(Cr) on both surfaces of the Cu plate(1) to form anti-oxidative layers(2-1,2-2); superposing an aluminum(Al) plate(3) and a stainless steel plate(4) on both surfaces of the Cu plate(1) having the anti-oxidative layers(2-1,2-2) and heating the resultant structure at 200-350deg.C; and pressure-bonding the superposed plates at 200-350deg.C.
申请公布号 KR20030090994(A) 申请公布日期 2003.12.01
申请号 KR20020028903 申请日期 2002.05.24
申请人 HONG, YOU PYO 发明人 HONG, YOU PYO
分类号 B32B15/01;(IPC1-7):B32B15/01 主分类号 B32B15/01
代理机构 代理人
主权项
地址