发明名称 METHOD FOR FABRICATING PHASE SHIFT MASK OF SEMICONDUCTOR DEVICE
摘要 PURPOSE: A method for fabricating a phase shift mask of a semiconductor device is provided to prevent a phase shift pattern from being affected by the particles caused by depositing and etching a light mask layer by forming the phase shift pattern in a pattern region, by making the phase shift pattern shielded by a photoresist pattern and by selectively forming the light mask layer in a blind region. CONSTITUTION: A quartz substrate(100) is prepared in which the pattern region and the blind region surrounding the pattern region are defined. The phase shift pattern(110a) is formed on the pattern region of the quartz substrate while a phase shift plate(110b) is formed on the blind region. A protection pattern is formed on the pattern region of the quartz substrate in which the phase shift pattern is formed. The light mask layer(140) is formed on the phase shift plate and the protection pattern in the blind region. The light mask layer is patterned to be left only on the phase shift plate in the blind region. The protection pattern is eliminated.
申请公布号 KR20030090877(A) 申请公布日期 2003.12.01
申请号 KR20020028476 申请日期 2002.05.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, MYEONG CHEOL;LEE, JEONG YUN
分类号 H01L21/027;(IPC1-7):H01L21/027 主分类号 H01L21/027
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