发明名称 RESIN COMPOSITION AND LIQUID SEALING MEDIUM
摘要 PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in workability and gives a cured product excellent in physical properties. SOLUTION: There are provided (1) a resin composition which contains a compound having a group represented by formula (I) (wherein R<SP>1</SP>, R<SP>2</SP>, and R<SP>3</SP>are the same or different and each H or a lower alkyl group; and X, Y, and Z are the same or different and each O or S with the proviso that at least two of them are S), an epoxy compound, a curing agent, and a curing catalyst; (2) a resin composition described in (1) with the proviso that the curing agent is an epoxy-reactive compound; and (3) a resin composition described in (1) with the proviso that the curing catalyst accelerates the reaction of an epoxy group with the curing agent. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003335843(A) 申请公布日期 2003.11.28
申请号 JP20020142554 申请日期 2002.05.17
申请人 KYOWA YUKA CO LTD 发明人 MURAYAMA SHUNICHI;MORIYAMA SATOSHI;MURATA SHIGERU;SHIMIZU IKUO
分类号 C09K3/10;C08G59/68;H01L23/29;H01L23/31;(IPC1-7):C08G59/68 主分类号 C09K3/10
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