| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant adhesive suitable for manufacturing a coil requiring a high-level heat resistance. SOLUTION: An alkoxysilane compound in an amount of 5-50 pts.wt. is incorporated with 100 pts.wt. of a base adhesive comprising a polyimide, a polyamide or an epoxy adhesive. COPYRIGHT: (C)2004,JPO
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