| 发明名称 |
SEMICONDUCTOR CIRCUIT DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To realize a semiconductor memory chip which can be incorporated in a single chip package and a multi-chip package. <P>SOLUTION: Data pad regions (95a-95d) are arranged in respective quadripartite regions of a semiconductor memory chip in a rectangular shape, and data pads are utilized selectively in each of the quadripartite regions in accordance with word constitution. <P>COPYRIGHT: (C)2004,JPO</p> |
| 申请公布号 |
JP2003338175(A) |
申请公布日期 |
2003.11.28 |
| 申请号 |
JP20020144972 |
申请日期 |
2002.05.20 |
| 申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
SUWA MASATO;MATSUMOTO JUNKO;YAMAUCHI TADAAKI;OKAMOTO TAKEO;ICHIGUCHI TETSUICHIRO;YONETANI HIDEKI;NAGASAWA TSUTOMU;DEN MASUNARI |
| 分类号 |
H01L27/04;G11C5/00;G11C5/02;G11C5/06;G11C8/00;G11C11/34;G11C11/401;G11C11/406;G11C11/407;G11C11/409;H01L21/822;H01L23/50;H01L27/10;H02J1/00;(IPC1-7):G11C11/401 |
主分类号 |
H01L27/04 |
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