发明名称 CIRCUIT BOARD, MULTILAYER CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To achieve stable electric connection between a conductive circuit and a conductive resin with low resistance, in a circuit board formed by provid ing the conductive circuits on both front and rear surfaces of an insulated substrate, and connecting the conductive circuits to each other with the conduc tive resin through a through hole formed in the insulated substrate. SOLUTION: The conductive circuit provided to the insulated substrate comprises a groove. The groove and the through hole are filled with the conductive resin to increase an area of a contact surface between the conductive circuit and the conductive resin. Thereby the electrical connection of them is absolutely obtained and resistance is lowered. To form the groove to the conductive circuit, a resist pattern whose width is sufficiently smaller than the thickness of the conductive circuit is used for alkali-etching. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003338668(A) 申请公布日期 2003.11.28
申请号 JP20020146832 申请日期 2002.05.21
申请人 FUJIKURA LTD 发明人 NAKAO SATORU;ITO SHOJI;OKAMOTO MASAHIRO
分类号 H05K1/11;H05K1/02;H05K3/40;H05K3/46;(IPC1-7):H05K1/02 主分类号 H05K1/11
代理机构 代理人
主权项
地址