| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the reliability of connection of a semiconductor element to an external electric circuit is reduced because the electric resistance of a conductor on a wiring board is high and breakage occurs in a low melting point wax material. SOLUTION: In the wiring board 4 composed of a square insulating substrate 1 composed of an electric insulating material and having a semiconductor element loading part on its surface, a large member of connection pads 6 formed on the lower surface of the insulating substrate 1 and a plurality of wiring conductors 2 led out from the loading part of the substrate 1 to the connection pads 6, auxiliary pads 9 whose outer sides are shaped like waveforms are formed on the corners of the lower surface of the substrate 1. COPYRIGHT: (C)2004,JPO |
