| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for packaging material for a semiconductor device, stabilizing operation of the device by effectively absorbing unnecessary electromagnetic wave, and solving inside electromagnetic wave noise without complicating process of production by forming a metal film for shielding by imparting an electroless plating property, and to provide a semiconductor device using the same. <P>SOLUTION: The epoxy resin composition contains 5-70 vol.% based on the epoxy resin composition, of a planular metal magnetic powder and 10-100 pts.mass per 100 pts.mass of the epoxy resin, of calcium carbonate having 0.1-20 μm average particle diameter. <P>COPYRIGHT: (C)2004,JPO |
