COOLING DEVICE FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an electronic component cooling device capable of improving the discharge performance of heat generated from a high heat generating electronic component. SOLUTION: A heat sink having a plurality of fins is arranged on the upper surface of a heat transmission plate 2 opposed in contact with a heating body 3 to be cooled and comb-like shielding boards 6 or erected shielding boards are inserted into the fins of the heat sink to improve a heat discharge characteristic. COPYRIGHT: (C)2004,JPO