| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin paste for a semiconductor having excellent adhesive strength and low elastic modulus when heated, excellent in reliability and caus ing neither exfoliation of a layer of the resin paste nor wire corrosion of the semiconductor device in solder crack resistance test and humidity test. <P>SOLUTION: The resin paste for the semiconductor comprises, as essential ingredients, (A) an epoxy resin, (B) a curing agent and (C) filler, wherein 5 pts.wt. compound represented by general formula (1) is included in the epoxy resin of 100 pts.wt. and the total of the compound represented by formula (1) and the epoxy resin contains ≤500 ppm hydrolyzable chloride. (Wherein, R<SB>1</SB>, R<SB>2</SB>and R<SB>3</SB>are the same or different 1-8C alkyl; and n is a mean value of 0-1.0 positive number). <P>COPYRIGHT: (C)2004,JPO |
