| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology to eliminate the increase of the thickness of a local area in the vicinity of a land when multiple layers are laminated on a circuit board which includes via holes and so-called inner via holes filled with conductive resin compounds for wiring to connect conductor circuits of front and rear surfaces and is formed in the multiple layers by the lamination of a plurality of layers. SOLUTION: There is provided a circuit board 11 wherein a land 4, which is connected to a projected portion 106 of a conductive resin composition 105 filling a hole 104 formed in the circuit board 101 laminated on a conductor circuit 3, is included to the conductor circuit 3 on the board 2 composed of an insulating material, and a projected portion absorbing part 5 in the structure of a recess to accommodate the projected portion 106 is also provided at the land 4 or its neighboring area. COPYRIGHT: (C)2004,JPO |
