| 发明名称 |
CURABLE RESIN COMPOSITION |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition which gives a cured product excellent in resistance to heat and moisture. SOLUTION: This composition contains a sulfoxide compound represented by formula (1) (wherein R<SP>1</SP>to R<SP>8</SP>are each H, a halogen or a 1-6C alkyl group; X<SP>1</SP>and X<SP>2</SP>are each independently O or S; and n is a mean repeat number, being a real number of 0-10). Preferably, all of R<SP>1</SP>-R<SP>8</SP>are H. COPYRIGHT: (C)2004,JPO
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| 申请公布号 |
JP2003335842(A) |
申请公布日期 |
2003.11.28 |
| 申请号 |
JP20030050344 |
申请日期 |
2003.02.27 |
| 申请人 |
SUMITOMO SEIKA CHEM CO LTD |
发明人 |
SUZUKI MICHIO;NISHIGUCHI HIDEAKI;KATAGIRI TOSHIFUMI |
| 分类号 |
C08G75/08;C08G59/30;C08G75/18;(IPC1-7):C08G59/30 |
主分类号 |
C08G75/08 |
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