| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve reliability by increasing bonding strength between an electronic component and leads and wettability with respect to a molding resin, in the manufacturing of a semiconductor device wherein the electronic component and the leads are connected to each other and then are sealed by a resin. <P>SOLUTION: A voltage is applied to an electrode 3 under the atmospheric pressure or pressure near the atmospheric pressure to generate gas discharge in gas supplied from a gas supply apparatus 4. At least either the electronic component 6 or the leads 7 are exposed to a gas active species generated by the gas discharge. Consequently, a reduced pressure environment is not necessary, and an apparatus can be reduced in size and made movable. Moreover, the apparatus has high processing performance at a low cost, and has little damage to a material to be processed, and can apply surface treatment to a local area if necessary. <P>COPYRIGHT: (C)2004,JPO |
