| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solid-state image pickup device which can suitably maintain focusing performance by a lens even if a light receiving face is covered by resin or the like and to provide a manufacturing method of the device. <P>SOLUTION: A channel 112 as a light receiving pixel is formed on a semiconductor substrate 110, and a gate insulating film 120, a gate electrode 121, an interlayer insulating film 122, an acrylic layer 123, a color filter 124 and a flattening layer 125 are sequentially laminated and formed above the channel. Convex lenses 130 whose semiconductor substrate 110 sides are flat in accordance with the respective pixels are formed on the flattening layer 125. The light receiving face of a chip of the semiconductor substrate 110 and a CCD image sensor 100 composed of members formed on the upper face of the substrate is stuck to a glass substrate 200 via an epoxy resin 210 whose refractive index is about '1.5'. The lens 130 is formed of a silicon nitride film (Si<SB>3</SB>N<SB>4</SB>) whose refractive index is about '2'. <P>COPYRIGHT: (C)2004,JPO</p> |
