| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide electronic parts with bump electrodes and its manufacturing method in which an open defect is adequately reduced in the manufacturing method, while there is provided a surface protecting insulation films having a substantial thickness and bump portions with sufficient heights. <P>SOLUTION: The electronic parts X1 with bump electrodes are each equipped with a substrate 11, an electrode pad 12 provided on the substrate 11, an insulation film 13 formed with an opening 13a corresponding to the electrode pad 12 and laminated on the substrate 12, a conductive connecting portion 14 provided on the electrode pad 12 in the opening 13a, and a bump 15 directly contacting with the conductive connecting portion 14 and protruding from the opening 13a. <P>COPYRIGHT: (C)2004,JPO</p> |
