发明名称 THIN-FILM SEMICONDUCTOR DEVICE, ELECTROOPTICAL DEVICE, ELECTRONIC EQUIPMENT, MANUFACTURING METHOD FOR THIN- FILM SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR ELECTROOPTICAL DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a thin-film semiconductor device in which a bottom-top gate type TFT can be formed by a small number of processes, an electrooptical device, electronic equipment, a manufacturing method of the thin-film semiconductor device, and a manufacturing method of the electrooptical device. <P>SOLUTION: In a TFT array substrate, a TFT 30g has both bottom and top-gate structures. In a first gate electrode 8d, an overhang 8e that does not overlap with a second gate electrode 3d in a plan view is formed. A conductive film 6f for connection formed on the upper layer of an interlayer insulating film 4 is electrically connected to the first and second gate electrodes 8d and 3d via contact holes 4m and 4n. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2003338628(A) 申请公布日期 2003.11.28
申请号 JP20020145159 申请日期 2002.05.20
申请人 SEIKO EPSON CORP 发明人 TAKENAKA SATOSHI
分类号 G02F1/1343;G02F1/1368;H01L21/336;H01L29/786;H01L51/50;H05B33/14;(IPC1-7):H01L29/786;G02F1/136;G02F1/134 主分类号 G02F1/1343
代理机构 代理人
主权项
地址