发明名称 PACKAGE SENSOR MODULE FOR REFLECTOR OPTICAL DEVICE AND FABRICATING METHOD THEREOF
摘要 PURPOSE: A package sensor module for reflector optical device and a fabricating method thereof are provided to lengthen a lifetime by combining an optical cable with an alloy mold and performing a packaging process by a molding compound. CONSTITUTION: A package sensor module for reflector optical device includes a reflector optical device, the first filler(32), an alloy mold(1), the second filler(51), and a molding compound(52). The reflector optical device is formed with a sensing reflector optical device formed between a buffer plate and a tension plate(25) and a reference reflector optical device. The first filler(32) is injected between the buffer plate and the tension plate(25). The alloy mold(1) includes a tension plate slot and a buffer plate slot. The second filler(51) is injected into a combined portion between the reflector optical device and the alloy mold(1). The molding compound(52) is used for molding an outer surface of the alloy mold(1).
申请公布号 KR20030089882(A) 申请公布日期 2003.11.28
申请号 KR20020027790 申请日期 2002.05.20
申请人 GEOTEL, INC. 发明人 PARK, SEUNG MIN
分类号 G02B6/42;(IPC1-7):G02B6/42 主分类号 G02B6/42
代理机构 代理人
主权项
地址