| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer machining device, which measures the condition of the machining surface while machining the semiconductor wafer, in a case wherein the semiconductor wafer is machined in a plurality of machining units while retaining the same with a common table. <P>SOLUTION: The machining device 10 is mainly constituted of an suction table 12, a grinding device 14, a sanding device 16 and a measuring device 17 while the semiconductor wafer 22 is retained by the suction table 12. The grinding device 14 is provided with a cup shaped grinding stone 24, pushed against one part of the rear surface 22B of semiconductor wafer 22, while the sanding device 16 is provided with an abrasive cloth 42, pushed against one part of the rear surface 22B. The measuring device 17 is provided in an area in the rear surface 22B, in which the cup shaped grinding stone 24 and the abrasive cloth 42 are not arranged, to measure the thickness of the semiconductor wafer 22. <P>COPYRIGHT: (C)2004,JPO |
