发明名称 HYDROGEN BARRIER LAYER AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE WITH THE SAME
摘要 PURPOSE: A hydrogen barrier layer and a method for manufacturing a semiconductor device with the same are provided to be capable of preventing the diffusion of hydrogen into a capacitor by using a ZrTiO layer as the hydrogen barrier layer. CONSTITUTION: A zirconium target(104) and a titanium target(105) are mounted in a deposition chamber(100). Mixed gases of argon and oxygen are supplied into the deposition chamber(100). Argon plasma is generated by ionization of argon gas. Thereby, a ZrTiO layer(108) is deposited on a wafer(102) loaded in the deposition chamber(100). Then, the ZrTiO layer(108) is densified, and oxygen is filled on the surface of the ZrTiOn layer(108).
申请公布号 KR20030089745(A) 申请公布日期 2003.11.28
申请号 KR20020027592 申请日期 2002.05.18
申请人 HYNIX SEMICONDUCTOR INC. 发明人 YOON, DONG SU
分类号 H01L27/105;H01L21/02;H01L21/316;H01L27/115;(IPC1-7):H01L27/105 主分类号 H01L27/105
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