发明名称 ETCHANT COATING APPARATUS AND METHOD FOR FABRICATING ETCHANT LAYER BY USING THE SAME
摘要 PURPOSE: An etchant coating apparatus and a method for fabricating an etchant layer by using the same are provided to reduce the consumption amount of etchant by forming the etchant layer in substrate units. CONSTITUTION: An etchant coating apparatus includes a substrate support plate(114) and a coating portion(118). The substrate support plate(114) is used for loading a substrate(112) including an etch target layer. The coating portion(118) includes an etchant inlet portion(118a) and a slit nozzle portion(118b). The slit nozzle portion(118b) forms an etchant layer(116) by coating the etchant(120) on the substrate(112). An method for fabricating an etchant layer by using an etchant coating apparatus includes a process for preparing an etchant coating apparatus(110), a process for arranging the substrate(112) including the etch target layer on the substrate support plate(114), a process for supplying the etchant(120) to the etchant inlet portion(118a), and a process for coating the etchant(120) on the substrate(112) by using the slit nozzle portion(118b).
申请公布号 KR20030089758(A) 申请公布日期 2003.11.28
申请号 KR20020027608 申请日期 2002.05.18
申请人 LG.PHILIPS LCD CO., LTD. 发明人 KIM, UNG GWON
分类号 H01L21/3063;(IPC1-7):H01L21/306 主分类号 H01L21/3063
代理机构 代理人
主权项
地址