METHOD AND SYSTEM FOR PLASMA PROCESSING

摘要

PROBLEM TO BE SOLVED: To provide a method and a system for plasma processing in which a uniform plasma can be generated with good firing properties under a low pressure.

SOLUTION: While introducing specified gas from a gas supply into a vacuum container provided with a deformed groove part 16 having a partially varying groove width in a plasma trap 14, the vacuum container is exhausted by means of an exhauster. While sustaining a specified pressure in the vacuum container, a high frequency power of 100 MHz is supplied from a high frequency power supply to an antenna 5. A plasma is fired under a low pressure of 1 Pa or less and the uniform plasma is generated in the vacuum container, so that a substrate can be subjected to uniform plasma processing.

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