| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve following problems: when a light-reception-surface electrode of a semiconductor is coated with solder, solder balls coagulated in ball shapes are formed on a grid electrode, although the solder balls alone cannot be easily removed in general, one part of the light-reception-surface electrode is also removed, a broken part is formed in the grid electrode, collection is not carried out effectively, and conversion efficiency in a solar cell is reduced. <P>SOLUTION: The semiconductor device comprises: a semiconductor substrate where the light-reception-surface electrode is provided on a light reception surface; a grid electrode provided on the light-reception-surface electrode so that the grid electrode becomes nearly vertical to the liquid level of molten solder when the semiconductor substrate is dipped in a soldering bath; and a bus electrode that is provided on the light-reception-surface electrode so that the bus electrode becomes nearly horizontal relative to a liquid surface and nearly orthogonally crosses the grid electrode. The grid electrode is formed of at least two parts having different widths, and the width of the part from a position where the grid electrode nearly orthogonally crosses the bus electrode to a fixed position toward a direction where the semiconductor substrate is dipped into the molten solder is wider. <P>COPYRIGHT: (C)2004,JPO</p> |
