| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that an electronic component cannot be operated always normally and stably by reason that a solder material sticks to the electronic component accommodated inside, and the reliability of hermetic sealing is low. <P>SOLUTION: The substrate 1 for mounting an electronic component is constituted by forming a mounting part A on which the electronic component 3 is mounted, and a square-frame-shaped metallized layer 6 for sealing which surrounds the mounting part A on the upper surface of an insulating base substance 4. The upper surface of the metallized layer 6 is slanted toward the inner peripheral side thereof. <P>COPYRIGHT: (C)2004,JPO</p> |
