METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a semiconductor device constituted by arraying external terminals parts like gratings on a plane, and to improve the reliability and electric characteristics of the semiconductor device in the manufacturing method of the semiconductor device.

SOLUTION: The manufacturing method includes a process for connecting an external terminal 26 formed by mutually connecting the prescribed number of frame-like terminals 27 mounted on a substrate and the prescribed number of cylindrical terminals 28 through a thin part 29 to a pattern 25 having terminal connections 32a corresponding to the frame-like terminals 27 and the cylindrical terminals 28 and pattern layers 32 formed so that connections 32b electrically connected to a semiconductor chip 41 to be mounted are arranged on upper parts of the terminals 27; a process for mounting the semiconductor chip 41 on the surface of the pattern 25 and electrically connecting the chip 41 to the pattern layers 32; a process for exposing the external terminal 26 and sealing the chip 41 by resin 23; and a process for separating connected states between the frame-like terminals 27 and the cylindrical terminals 28 on the external terminal 26 and connected states between respective cylindrical terminals 28.

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