| 摘要 |
PROBLEM TO BE SOLVED: To avoid deterioration in an element function, element breakdown and the like due to thermal fatigue, by reducing thermal stress caused by a soldering layer or the like in a thermoelectric element using a thermoelectric semiconductor. SOLUTION: The thermoelectric element 1 is composed by connecting an n-type thermoelectric semiconductor and a p-type thermoelectric semiconductor 5 that are alternately aligned on a support member 2 in series by first and second electrodes 6 and 7 that are joined to ends of the semiconductors via the soldering layers 8 and 9, respectively. The soldering layers 8 and 9 for joining thermoelectric semiconductors 4 and 5 to the electrodes 6 and 7 is composed of composite solder containing a thermal expansion inhibitor, such as metal powder, a metal fiber, ceramics powder, and a ceramics fiber, where average a linear expansion coefficient from 25 to 100°C is smaller than a soldering base material and the inhibitor has a volume ratio of 5 to 80%. COPYRIGHT: (C)2004,JPO |
