| 摘要 |
PROBLEM TO BE SOLVED: To provide a BGA package and its manufacturing method capable of suppressing the deterioration of a product due to external pollution and the reduction of yield without adding new processes and securing the degree of freedom in design. SOLUTION: The BGA package is provided with a semiconductor element 3, a substrate 1 for mounting the element 3, bonding pads 2 formed on the surface of the substrate 1 so as to be connected to the element 3, and resin 5 for covering at least the element 3 and the pads 2 without exposing them. Before covering the element 3 and the pads 2 with the resin 5, lead wires connecting respective bonding pads 2 are cut off and removed. COPYRIGHT: (C)2004,JPO |
