| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide resin paste which retains a low warping property, has excellent flexibility, adhesiveness to sealants, solvent resistance and chemical resistance, is soluble in nitrogen-free polar solvents, and has low temperature curability, excellent heat resistance, electric characteristics, moisture resistance, workability and profitability, and to provide a coating film-forming material containing the same. SOLUTION: This polyimide resin paste is characterized by comprising (A) 100 pts.wt. of a polyimide resin prepared by reacting (a) an acid anhydride group-containing tetrabasic polycarboxylic acid, (b) a diisocyanate represented by the general formula (I) [R groups are each independently a 1 to 18C alkylene; X groups are each independently a 1 to 18C alkylene or arylene; (m) and (n) are each independently an integer of 1 to 20] and having a number-average mol.wt. of 500 to 10,000, and (c) an aromatic polyisocyanate in a nitrogen-free polar solvent, (B) 1 to 50 pts.wt. of an epoxy resin, and (C) 1 to 90 pts.wt. of inorganic or organic fine particles, and having a thixotropic property, and the coating film-forming material containing the same. COPYRIGHT: (C)2004,JPO
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