发明名称 AQUEOUS EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an aqueous epoxy resin composition which contains a surfactant in an amount less than contained so far without containing an organic solvent, is excellent in storage stability, especially excellent in curability and dryability, and is suitable for a coating material requiring high adhesiveness and resistance to water, chemicals, and corrosion. SOLUTION: The composition comprises (A) an epoxy resin, (B) a curing agent therefor, and (C) a surfactant. The epoxy resin (A) comprises (a1) an epoxy resin prepared from a dihydroxybenzene derivative having a 3-9C aliphatic hydrocarbon group on the aromatic ring and an epihalohydrin and/or (a2) an epoxy resin prepared from the epoxy resin (a1) and (D) a phenol as essential components. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003335841(A) 申请公布日期 2003.11.28
申请号 JP20020142886 申请日期 2002.05.17
申请人 DAINIPPON INK & CHEM INC 发明人 MIYAZAWA MASASHI;YAMAZAKI TETSUYA
分类号 C08G59/24;C08G59/50;C09D5/00;C09D163/00;(IPC1-7):C08G59/24 主分类号 C08G59/24
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