| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which comprises a copolyamide and apatite, is suitable for mechanical industry, electric parts, electronic parts, and the like, has excellent molding properties such as excellent melt viscosity stability and excellent mold stain reduction on molding, gives molded articles having excellent mechanical properties, appearances, and has excellent weather resistance, rigidity on the absorption of water, and the like. SOLUTION: This copolyamide resin composition is characterized by comprising 100 pts.wt. of (A) a copolyamide which comprises 90 to 99.9 wt.% of polyamide 66 units and 0.1 to 10 wt.% of polyamide 6 units and whose terminals are sealed with a monocarboxylic acid or a monoamine in an amount of 1 to 80 (mequivalent/kg), (B) 0.1 to 30 pts.wt. of apatite, and (C) 0.01 to 1 pt.wt. of one or more organic heat stabilizer selected from hindered phenols and phosphites. COPYRIGHT: (C)2004,JPO
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