ELECTRONIC PART AND MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electronic part having superior characteristics with no risk of damage of the elemental characteristics, by ensuring package sealing.

SOLUTION: The electronic part includes; a package 14 having an external electrode 15 extended from an inner bottom face to an outer surface and an opening; an SAW element 10 having an IDT 12 and a connecting electrode 13; a bump 17 for mounting the SAW element on the package 14, and connecting an external electrode 15a and the connecting electrode 13 of the SAW element 10; and a resin 18 for covering the backside of the SAW element and the opened part of the package 14. A length from the resin 18 to the inner bottom face of the package 14 is longer than that from the SAW element 10 to the inner bottom face of the package 14 and smaller than that from the inner bottom face of the package 14 to the upper edge thereof.

COPYRIGHT: (C)2004,JPO