METHOD AND APPARATUS FOR CUTTING SILICON WAFER BY USING LASER BEAM

摘要

PURPOSE: A method and an apparatus for cutting a silicon wafer by using laser beam are provided to prevent the abrasion of a nozzle and enhance the productivity by using a normal jumping nozzle. CONSTITUTION: A water tank including an inlet and an outlet is connected to a draining device including a jumping nozzle. A lens is located at an upper portion of the water tank. A silicon wafer is located at a lower portion of the water tank. Water is supplied to the water tank through the inlet. The water is drained from the water tank by using the draining device. The laser beam is generated by a laser source. The laser beam of the laser source is focalized on a surface of the silicon wafer through the lens. The silicon wafer is cut by using the laser beam.