发明名称 MANUFACTURING METHOD OF LIGHT EMISSION ELEMENT AND LIGHT EMISSION ELEMENT MANUFACTURED BY THE METHOD
摘要 PROBLEM TO BE SOLVED: To provide a ridge waveguide type nitride semiconductor light emission element which has a stable characteristic such as a threshold current, has high production efficiency and has favorable reproducibility by easily controlling an etching depth and thereby adjusting the thickness of a semiconductor layer accurately in dry-etching to a ridge shape. SOLUTION: The manufacturing method of the ridge waveguide type nitride semiconductor light emission element has an etching rate change layer between a contact layer dry-etched to a ridge shape and an active layer. In dry-etching to a ridge shape, the surface of a wafer is irradiated with light, an etching rate change layer is detected by a film thickness interference signal of reflection light and an etching depth is controlled. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003338662(A) 申请公布日期 2003.11.28
申请号 JP20020147777 申请日期 2002.05.22
申请人 SHARP CORP 发明人 KANEKO YOSHIKA
分类号 H01S5/22;H01S5/323;(IPC1-7):H01S5/22 主分类号 H01S5/22
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