发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To test in a bated a large region of an electrode pad of a test body in an electrical characteristic test process that is one of semiconductor manufacturing processes. SOLUTION: The electrical characteristic test is performed by pressing a testing structure to a test body using a magnetic force. The testing structure is formed with electrically independent protrusions whose number is equal to that of test target conductors formed in a region targeted for the test of the test body. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003338529(A) 申请公布日期 2003.11.28
申请号 JP20020145554 申请日期 2002.05.21
申请人 HITACHI LTD 发明人 SAHO NORIHIDE;ISOKAMI HISASHI;KONO AKIOMI;KANAMARU MASATOSHI;SHIMIZU HIROYA
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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