发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To test in a bated a large region of an electrode pad of a test body in an electrical characteristic test process that is one of semiconductor manufacturing processes. SOLUTION: The electrical characteristic test is performed by pressing a testing structure to a test body using a magnetic force. The testing structure is formed with electrically independent protrusions whose number is equal to that of test target conductors formed in a region targeted for the test of the test body. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2003338529(A) |
申请公布日期 |
2003.11.28 |
申请号 |
JP20020145554 |
申请日期 |
2002.05.21 |
申请人 |
HITACHI LTD |
发明人 |
SAHO NORIHIDE;ISOKAMI HISASHI;KONO AKIOMI;KANAMARU MASATOSHI;SHIMIZU HIROYA |
分类号 |
H01L21/66;(IPC1-7):H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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