发明名称 METHOD FOR FORMING CONTACT PLUG WITH LOW CONTACT RESISTANCE
摘要 PURPOSE: A method for forming a contact plug is provided to be capable of reducing the contact resistance by restraining the growth of a native oxide. CONSTITUTION: After forming an interlayer dielectric(26) on a silicon substrate(20) having a transistor, a contact hole is formed by selectively etching the interlayer dielectric. A native oxide layer is removed by cleaning the contact hole. An epitaxial silicon layer(28) is partially grown on the exposed silicon substrate(20) by SEG(Selective Epitaxial Growth) using the first reactor of 10¬-6 Torr below. A polysilicon layer(30) is entirely filled into the contact hole by using the second reactor of 0.2-1.5 Torr.
申请公布号 KR20030089744(A) 申请公布日期 2003.11.28
申请号 KR20020027591 申请日期 2002.05.18
申请人 HYNIX SEMICONDUCTOR INC. 发明人 CHAE, SU JIN;KIM, HAE WON
分类号 H01L21/28;H01L21/60;H01L21/768;H01L21/8242;(IPC1-7):H01L21/28 主分类号 H01L21/28
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